JEDEC STANDARD Board Level Drop Test Method of Components for Handheld Electronic Products JESDB JULY JEDEC SOLID. The reliability of this package has been studied by employing the JEDEC JESDB standard drop test. In this paper, the JEDEC B-condition is applied to. The need for RoHS compliant boards coupled with the demand for reliable electronics has resulted in the development of the JEDEC Standard JESD B to.
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In addition, a rectangular rosette strain gage shall be mounted on this set-up board underneath position U8 on the other side non-component side of the board to characterize strains in x and y directions as well as the principal strain and principal strain angle.
Both accelerometer and stain gage shall be connected to data acquisition system capable of measuring at a scan frequency of 20 kHz and greater with a 16 bit signal width. The initial resistance of all nets for each assembly shall be measured and logged before conducting the first drop. A lightweight accelerometer such as Endevco model 22, 0. At least one board shall be used to adjust board mounting process such as paste printing, placement, and reflow profile. This shall be accomplished by designing double sided boards with mirror component footprint on each side top and bottom of the board.
This plate will serve as the mounting structure for the PCB assemblies. Other suggestions for document improvement: The standard is not meant to cover the drop test required to simulate shipping and handling related shock of electronic components or PCB assemblies.
BOARD LEVEL DROP TEST METHOD OF COMPONENTS FOR HANDHELD ELECTRONIC PRODUCTS
This method is not intended to substitute for full characterization testing, which jfsd22 incorporate substantially larger sample sizes and increased number of drops. I recommend changes to the following: The x, y location of the center of each component location is listed in Table 4, using the center of lower left screw hole as datum.
All failures after each drop shall be logged. The additional data shall directly compare the effect of optional component mounting 1 or 5 components to the preferred component mounting configuration. It should be noted, however, that any additional mass will add significant dynamic jesc22 to the board and may alter its dynamic response. During the test, the shock pulse shall be measured for each drop to ensure that input pulse remains within the specified tolerance.
No claims to be in conformance with this standard may be made unless all requirements stated in the standard are met.
Strain rate shall also be calculated by dividing the change in strain value by the time interval during which this change occurred. Similarly, a jessd22 group containing components in Group B and D may also exist. An electrical discontinuity of resistance greater than ohms lasting for 1 microsecond or longer.
Experiments with different strike surface may be needed to achieve the desired peak value and duration. It should be noted that the peak acceleration and the pulse duration is a function of not only the drop height but also the strike surface. A visual inspection shall be performed on all boards for solder mask registration, contamination, and daisy chain connection.
The capture pad diameter shall be at least microns. Depending on the number of components mounted per board, Table 5 shall be used to determine the minimum quantity of assembled board g111 for testing and total number of components to be tested.
Electrical continuity test shall also be performed on all mounted units to detect any opens or shorts. Plated through holes or edge fingers shall be provided on each end of the board for soldering wires, one for each side top and bottom of the board.
The die size and thickness should be similar to the functional die size to be b11 in application.
This includes all traces making contact with solder joint interconnect as well as all internal layers. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface mounted components while duplicating the failure modes normally observed during product level test.
A visible partial separation of component from the test board, even without a significant increase in resistance or intermittent discontinuity, shall also be considered as a failure.
The test data generated using such a board shall be correlated at least once by generating the same data on same component using the preferred board defined in this document.
JESDB B Board level drop test menthod of components for handheld eletronic products_百度文库
If you can provide input, please complete this form and return to: The selection of packages should cover different locations on the board.
In case of rectangular components, the longer side of the component should be parallel to the longer side of the board when mounted. Because of various design for test and design for failure analysis practices used in the industry, it is recognized that populating boards with all 15 locations may not leave enough room between components for large number of test points to properly identify the exact failure location. Multiple drops maybe required while adjusting the drop height and strike surface to achieve the specified G levels and pulse duration Gs, 0.
By downloading this file the individual agrees not to charge for or resell the resulting material. Therefore, it is recommended that this characterization should only b111 done on a set-up board. The jeds22 shall still be designed as double-sided with footprint of similar sized components on each side. Although it is recommended that this characterization be performed for previously untested components, this may not be required if such characterization data is available for similar sized component.
This is the applied shock pulse to the base plate and shall be measured by accelerometer mounted at the center of base plate or close to the support posts for the board.